Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors
View original at finance.yahoo.comKyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors Multilayer ceramic core substrate for advanced semiconductor packaging2.5D integration warpage comparison and simulation model To be shown at ECTC 2026, May 26-29 in Orlando; new substrate technology delivers superior rigidit…
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Kyocera's multilayer ceramic core substrate provides greater rigidity and resistance to deformation than core substrates made of organic materials.
60% confidenceThe new multilayer ceramic core substrate dramatically reduces deformation (warpage) in high-performance semiconductor packages.
60% confidenceCore substrates made of organic materials create a bottleneck to higher performance at larger dimensions due to warpage and wiring-miniaturization challenges.
60% confidenceThe growth of generative AI and large language models is fueling a global proliferation of AI data centers and creating demand for higher-performance xPU and ASIC semiconductors requiring larger, denser package substrates.
60% confidenceKyocera's multilayer ceramic technology can enable higher device performance using slimmer substrates while facilitating further miniaturization.
60% confidenceThe multilayer ceramic structure allows greater circuit miniaturization through high-density, three-dimensional wiring.
60% confidence